AI chip bottleneck shifts to Taiwan packaging

The advancement of artificial intelligence is encountering a new potential bottleneck, not in chip design or manufacturing, but in the crucial step of advanced packaging. Nvidia has reportedly secured a substantial portion of TSMC's most sophisticated packaging capacity. This specialized process, often overlooked, is becoming critical for high-performance AI chips. The reliance on Taiwan for this essential stage highlights a vulnerability in the global AI supply chain, suggesting that future AI development could be constrained by the availability of this specific manufacturing capability.