ModulEdge, Comino Partner for AI Infrastructure

ModulEdge and Comino have announced a partnership to deliver turnkey on-premise AI infrastructure solutions tailored for European enterprises. ModulEdge, a Czech manufacturer of modular data centers, will collaborate with Comino, a European leader in liquid cooling solutions, to provide integrated systems. This collaboration aims to simplify the deployment and management of AI hardware, addressing the growing need for efficient and powerful computing infrastructure. The partnership focuses on offering scalable, high-performance solutions that meet the demanding requirements of AI workloads.